The long-term, reliable protection of sensitive electronic components is essential to many electronic applications today. Increasingly smaller systems and rising circuit densities have resulted in hotter operating temperatures and have driven the demand for high-performance solutions for heat dissipation.
Designers confronting these challenges will find a range of solutions from Momentive Performance Materials including the SilCool* product line of thermal interface materials. This family of adhesives and compounds can deliver high-thermal conductivity, thin bond lines, and low thermal resistance required for high-performance components.
Thermally Conductive Silicone Grease Compounds
Momentive’s thermally conductive SilCool grease compounds offer excellent thermal conductivity and low bleed, as well as excellent stability, penetration and temperature resistance. These properties enable SilCool grease compounds to draw heat away from devices, contributing to improved reliability and operational efficiency of electronic components.
Click here for the typical physical properties of key SilCool grease products
Typical Performance Data of Key SilCool Grease Products
Thermally Conductive Silicone Adhesives
The SilCool family of silicone adhesives from Momentive offers 1-Part, heat curable materials that bond well to a wide variety of substrates without the need for primers. They help deliver exceptional thermal conductivity, low thermal resistance, excellent dielectric properties, and low stress. SilCool adhesives are excellent candidates to consider for addressing the heat management challenges arising from the higher frequencies, power, and miniaturization in today’s electronic devices.
View typical properties of key SilCool adhesive products.
Thermally Conductive Silicone Potting Compounds and Encapsulants
Momentive Performance Materials offers a variety of heat or room temperature cure, thermally conductive potting materials that help remove heat from critical components. These grades cure to form a soft stress-relieving rubber, and consist of low-viscosity grades for potting applications, as well as grades with moderate viscosities that can provide the necessary dispense stability for bead formulation. This category of thermal products also includes grades that can be considered for use as gap fillers or as liquid-dispensed alternatives to thermal pads..
For typical properties of key potting compounds and encapsulants, click here.
In the link above, the typical physical properties are show for TIA207GN, TIA222G, TIA223GLZ and TIA216G. The reliance data for TIA207GN are demonstrated below.
For more information on our full thermal product line, view our Thermal Management Materials brochure.
Oder Kontakt: SINUS electronic GmbH - Produkt Marketing Michael Ruß - T.07132 9969 20