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Aktuelles

SilCool* TIG 210 BX thermal management grease from Momentive Performance Materials provides a reliable and cost-effective solution for automotive electronic applications.

Where heat dissipation at low bond line thicknesses is required in automotive electronic applications, Momentive offers an excellent material solution to use ... [mehr]

Momentive to Showcase New Electronics Materials at Material Japan 2010

ALBANY, N.Y., January 19, 2010 - Momentive Performance Materials will be exhibiting a range of new advanced materials for use in microelectronics applications at Material Ja ... [mehr]

Semtech Adds Ultra-Miniature Temperature Sensor and Monitor to Sensing Platform to Boost Equipment Reliability and Energy Savings

  Highly integrated SX8733 monitors up to two temperature diodes and its own temperature; its ... [mehr]

Silicon Potting Material RTV 12-A+C nun auch mit UL-Zertifikation

... [mehr]

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Logo MomentiveSonderaktionen

Wir bieten auf die nachstehend gelisteten Produkte einen Sonderrabatt von bis zu 25 % Prozent, da in Kürze der Ablauf der garantierten Shelflife droht. Unabhängig hiervon ist jedoch die Qualität des Produktes weiter hin gewährleistet.

Das Material ist getestet auf Verwendung nach der Originalspezifikation. Die aufgeführten Produkte werden mit dem originalen Certificate of Conformance geliefert. Bitte kontaktieren Sie uns bezüglich weiterer Details.

IS5128E-PAIL

1-K-Silikon; alkoxy; paste; transl; ROHS
Pail white (20l - 18,1kg); SAP # 61819 / TSL=360

IS 5128 E adhesive/sealant are one component neutral RTV's which quickly cure to form elastic, flexible silicone rubbers. The products are specially developed to be non-corrosive to metals including copper and copper alloys, coupled with fast cure. IS 5120 E series have a thixotropic paste consistency, excellent dielectric properties and excellent primerless adhesion to plastics like polycarbonate, which make these materials ideal for electronic applications as well as for sealing bonding high performance plastics.

  • non-corrosive to metals
  • fast cure
  • non-acid cure, low smell, no irritating vapours
  • compatible with polycarbonate
  • excellent dielectric properties
  • service temperature -50° to +150° C

TSE325-D-JAR-1KG

1-K-Silikon; addition; Dose 1,0 l, 1 KG
fließfähig; weiss; ROHS; SAP # 62535 / TSL=365

TSE325 - is a white, flowable material with self-leveling properties. TSE325 silicone adhesive is a one-component heat curable silicone adhesive designed for potting and encapsulation. This product adheres to many substrates without a primer and cures at elevated temperatures. This product has a very long working time at room temperature.

  • One component products - no mixing required
  • Cure at elevated temperature
  • Low viscosity - easily pourable
  • Primerless adhesion to many types of substrates
  • No cure by-products, low linear shrinkage
  • Non-corrosive to metals and sensitive substrates
  • Outstanding performance over a wide temperature range
  • Coating of hybrid IC's, printed circuit boards, etc
  • Electrical potting and encapsulation
  • General adhesive for many types of substrates